Specifications & capabilities
Material Aluminum base
Blind & Burried 4+N+4 Laser drill
TU768 0.039” ±0.004” Thick
Special (lateral) counter board
Blind & Burried 1+FLEX+1 Laser drill
MATERIAL—Ro3003+FR4 PP—Ro3001 bonding film+FR4 PP
Blind & Burried 9+2+9 Laser drill
Blind & Burried 2+6+2 Laser drill
HDI-SBU Microvias Capability
Formed using laser drill with via filled copper plating.
Plated filled blind microvia advantage.
- Reduces capture pad size of fine pitch BGA.
By reducing the via hole size, it significantly helps the designer to obtain more routing spaces.
- Reduces board real estate for slimming and portability purposes.
By reducing the board size and weight of the product, it improves the electrical performance of the system.
- Increases reliability
Providing stacked vias allows stronger interconnections and obtains better thermal management.
This also significantly increases board reliability at more severe operation circumstances.