Formed using laser drill with via filled copper plating. Plated filled blind microvia advantage.
Reduces capture pad size of fine pitch BGA. By reducing the via hole size, it significantly helps the designer to obtain more routing spaces.
Reduces board real estate for slimming and portability purposes. By reducing the board size and weight of the product, it improves the electrical performance of the system.
Increases reliability Providing stacked vias allows stronger interconnections and obtains better thermal management. This also significantly increases board reliability at more severe operation circumstances.