Main production facilities
Full range of PCB manufacturing and assembly services to fit all your printed circuit board capability needs.
CIREX FRANCE has introduced world-class PCB production equipment and high-precision testing equipment. We adopted a scientific management model to form a strong and leading process manufacturing capability.
1 to 16 layers of PCB boards,
a minimum aperture of 0.1mm,
a minimum line width,
minimum trace width/space 0.075mm,
Line gap 0.075mm,
0.4mm BGA Pitch
Highest quality & reliable products
- Impeccable quality system support
- Delivering high reliability PCBs
On-time delivery
- All that the name implies is quickness.
Process & equipment
| Process | Equipement | Quantité |
|---|---|---|
| CAM engineering | Par CAM (IGI), InCAM | 30 |
| Film laser plotter (EIE SWISS) | 3 | |
| Dry film | UV exposure machine | 4 |
| LDI (laser direct image) | 2 | |
| Thin core pre-treatment line | 1 | |
| Thin core etch/strip line | 1 | |
| CCD camera (punch A/W) | 1 | |
| Dry film laminator | 3 | |
| Automatic dry film laminator | 1 | |
| Thin core dry film developing line | 1 | |
| AOI system | CAMTEK Orion 706 (6/6 mils) | 1 |
| CAMTEK Orion 868 (4/4 mils) | 1 | |
| Orbotech Discovery-OLB (1.6/1.6 mil) | 1 | |
| Orbotech Fusion 22 (1/1 mil) | 2 | |
| Gold plating | Electrolytic hard gold plating line | 1 |
| Electrolytic soft gold plating line | 1 | |
| Immersion gold plating line (ENIG) | 1 | |
| Lamination | Automated black oxidation line | 1 |
| Vacuum lamination hot press (Vigor) | 6 | |
| Vacuum lamination cold press (Vigor) | 1 | |
| Vacuum high-speed lamination machine (Vigor)-Flex PCB | 1 | |
| Dual x-ray target drilling system (AbleTek) | 1 | |
| Drilling | NC drilling machine (160K RPM) Tongtai;Spindle number: | 40 |
| NC drilling machine (160K RPM) Takisawa;Spindle number: | 6 | |
| NC drilling machine (200K RPM) Via tecnology;Spindle number: (2014) | 6 | |
| Pre-treatment (belt scrubbing & micro-etch) | 1 | |
| Laser drill (Mitsubishi-ML605GTWⅡ-H) | 1 | |
| X-ray (registration controller) | 1 | |
| Copper plating | Chemical desmear (permanganate) & PTH line | 1 |
| Plasma desmear (2014) | 1 | |
| High-pressure hydraulic de-burr line | 1 | |
| Surface copper subtracted line | 1 | |
| Panel plating line | 1 | |
| Acid cupric chloride etching line | 1 | |
| HDI via filled copper plating (Two baths) | 1 | |
| HDI via filled copper plating (one bath) | 1 | |
| Pattern plating line | 1 | |
| Alkaline ammonia etching line | 1 | |
| Solder mask | Surface pre-treatment line | 1 |
| Semi-auto printing machine | 4 | |
| UV exposure machine (7 KW) | 2 | |
| Optical alignment exposure machine (8 KW) | 1 | |
| Solder mask developing line | 1 | |
| LED direct imaging (SCREEN)(2014) | 1 | |
| Silkscreen | Printing workstation (manual) | 3 |
| UV exposure machine (3 KW) for stencil | 1 | |
| Inkjet legend printer (Sprint-100 Orbotech) | 2 | |
| Fabrication | CNC router machine (18 spindles) | 6 |
| Beveling machine | 1 | |
| V-groove machine | 1 | |
| Electrical test | Dedicated tester (SINK) | 1 |
| Flying probe type testers | 7 | |
| Emma (ELX6146-limitation by 5 mils) | 1 | |
| Emma (E4M6151-limitation by 2 mils)(2014) | 1 | |
| Mania (U8-Board size 24” x 27” Max.) | ||
| TDR measurement | Polar CITS500S | 1 |
| Polar CITS900S4 | 1 | |
| Agilent E5063A ENA Series network analyzer (2014) | 1 | |
| FQC | Hole counter | 1 |
| IR reflow | 1 | |
| Final cleaning machine | 1 | |
| Shipping | Vacuum packaging machine | 2 |
