Process capabilities

HDI-SBU Microvias Capability

Formed using laser drill with via filled copper plating.
Plated filled blind microvia advantage.

• Reduces capture pad size of fine pitch BGA.
  By reducing the via hole size, it significantly helps the designer to obtain more routing spaces.
  

• Reduces board real estate for slimming and portability purposes.
  By reducing the board size and weight of the product, it improves the electrical performance of  the system.

• Increases reliability
  Providing stacked vias allows stronger interconnections and obtains better thermal management.
  This also significantly increases board reliability at more severe operation circumstances.

Material CEM-3，FR-4(Normal to High Tg)，High CTI FR-4，Polyimide(PI) ，Aluminum Base，Rogers
Surface finish : HAL, HASL Leadfree, ENIG, Chem Tin, OSP, Gold Finger, Immersion Silver, ENEPIG
Min. Core thickness 4mil/0.1mm
Prepreg type 1080, 2116, 7628, 106, 3313, 2165, 1500.
Max board size 24.41X47.24inch/620X1200mm
Copper thickness
Min. base copper  1/3Oz
Max. base copper  10Oz
Min. board thickness